TP03500 ThermoChuck® Systems

For the testing, cycling and characterization of wafers and other flat devices at precise temperature System Type           Temperature Range        TP03500A                -65°C  to +200°C                        TP03500C                +15°C to +300°C        TP03500D                +20°C to +300°C        TP03500E                Ambient  to +300°C Outstanding Features: Patented TP03500 ThermoChuck® design provides exceptional thermal and mechanical stability and precision.   • Superior Temperature Uniformity: At temperatures to +200°C: ±0.5% or ±0.5°C, whichever is greater At temperatures = or > 200°C: ±1.0% of set temperature • Surface Flatness @ +200°C: <12.5 microns ( 200 mm ); <25 microns (300mm) @ +300°C: <25 microns • Surface to Base Parallelism: <20 microns @ +200°C • Surface Isolation: > 109 ohms standard; >1014 ohms available • Surface Capacitance at ambient: 200 mm chuck: <750 pf standard, < 250 pf option available 300 mm chuck: <800 pf standard, < 500 pf option available   • Deflection: 200 mm: <15 microns at 65 Kg 300 mm: <6 microns at 50 Kg   • Low noise DC Control System keeps electrical noise to a minimum. • Modular System Design for convenient, cost-effective system upgrades as wafer diameter and temperature requirements change. • CE Approved, ETL listed for U.S.A. and Canada and Compliant with SEMI S2-93A standards.

Standard Features:

• • Temperature Stability ±0.1°C
• • Precise temperature control and accuracy
• • Ramp/soak/cycle programming is controllable from front panel or via remote interface.
• • EEE-488 and RS232 remote interface included.
• • Integrates with most major wafer probing stations, laser trimmers and inspection stations.
• • HCFC and CFC-free

Applications:

• • Thermal cycling and steady-state thermal testing of wafers, hybrids and other flat devices at precise temperature
• • Ultra low noise test applications
• • High isolation for low leakage (femtoamp level), low capacitance test measurements; Co-axial and tri-axial configurations are available.
• • Ideal for high power and high probe load applications
• • Cold testing of wafers

Modular System:

The TP03500 System controller operates with the user's choice of:

1) ThermoChuck Diameter
Choice of 200mm ( 8 inch) or 300mm ( 12 inches) to accommodate wafers up to 300mm in diameter

2) ThermoChuck Surface
Choice of Gold-plated or nickel-plated surface is standard. (Other surface treatments are optional; contact Temptronic).

3) High temperature capacity
 200 mm ThermoChuck: Choice of 200ºC, 300C or 400ºC
 300 mm ThermoChuck: Choice of 200ºC or 300ºC

4) Low temperature capacity / cooling system
Choice of Chiller for ultra low temperature capabilities

5) Power Configuration
Available in a full range of power configurations. Contact Temptronic for details

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